: Focuses on peak values of principal strain and strain rate to identify "hazardous" processes that exceed established safety margins. Relationship with IPC/JEDEC-9702
A: IPC-9704 specifically references physical strain gages. DIC is acceptable for research, but for compliance, the PDF requires ASTM E1562-style gage rosettes. ipc-9704 pdf
With the industry's shift to lead-free solder (RoHS compliance), the reliability characteristics of solder joints changed. IPC-9704 provides the data and methods needed to qualify these new materials, ensuring that lead-free joints can withstand thermal cycling without failing prematurely. : Focuses on peak values of principal strain
This guide provides detailed information on the design, manufacture, and testing of PCBs for high-reliability aerospace and defense applications. It covers topics such as: With the industry's shift to lead-free solder (RoHS
The IPC/JEDEC-9704 standard establishes methodologies for measuring mechanical strain on PCBs during assembly, test, and handling to prevent failures like solder joint fracture and pad cratering. It requires identifying high-risk processes, such as SMT and press-fit insertion, and placing strain gages within 5mm of critical components. For details on purchasing the standard, visit Nimonik Standards . IPC/JEDEC-9704 Strain Gage Guidelines | PDF - Scribd